Packaging project of inertial sensors using LTCC technology

• Grant number: 19/17658-5
• Support Opportunities: Scholarships in Brazil - Master
• Start date: September 01, 2019
• End date: April 30, 2022
• Field of knowledge: Engineering - Electrical Engineering - Electrical, Magnetic and Electronic Circuits
• Principal Investigator: Antonio Carlos Seabra
• Grantee: Armando Hector Rodríguez
• Host Institution: Escola Politécnica (EP). Universidade de São Paulo (USP). São Paulo , SP, Brazil
• Associated research grant: 17/50343-2 - Institutional development plan in the area of digital transformation: advanced manufacturing and smart and sustainable cities (PDIp), AP.PDIP

Abstract

LTCC (Low Temperature Cofired Ceramics) technology has a vast variety of applications due its adaptability to the different necessities that may arise during the development of an electronic device especially MEMS devices for the different purposes or situations in which we may want to use or apply them, or the amount and frequency of data that is intended to be gathered or monitored and the conditions to which the electronic sensor will be submitted. Taking into account the particularities and requisites of inertial sensors for smart cities, the way of integration of the different blocks of the final device (ex. Inertial transductor, conditioning circuits, transceiver, etc.) is important and impacts severely in its performance. That's why is this work purpose to project the integration and packaging of the final device using LTCC, in order to satisfy the specifications and adequate the sensors to the applications in question. (AU)