International Integrated Reliability Workshop

• Grant number: 14/18210-4
• Support Opportunities: Research Grants - Meeting - Abroad
• Start date: October 12, 2014
• End date: October 16, 2014
• Field of knowledge: Engineering - Electrical Engineering
• Principal Investigator: Roberto Lacerda de Orio
• Grantee: Roberto Lacerda de Orio
• Host Institution: Faculdade de Engenharia Elétrica e de Computação (FEEC). Universidade Estadual de Campinas (UNICAMP). Campinas , SP, Brazil

Scientific publications

(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)

DE ORIO, R. L.; GOUSSEAU, S.; MOREAU, S.; CERIC, H.; SELBERHERR, S.; FARCY, A.; BAY, F.; INAL, K.; MONTMITONNET, P.; IEEE. On the Material Depletion Rate due to Electromigration in a Copper TSV Structure. 2014 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP FINAL REPORT (IIRW), v. N/A, p. 4-pg., 2014-01-01. (14/18210-4)