Development and characterization of thin films of PA6/LLDPE/black carbon for antistatic package

• Grant number: 18/07617-7
• Support Opportunities: Scholarships in Brazil - Scientific Initiation
• Start date: June 01, 2018
• End date: July 31, 2020
• Field of knowledge: Engineering - Materials and Metallurgical Engineering - Nonmetallic Materials
• Principal Investigator: Fabio Roberto Passador
• Grantee: Leonardo Nishiguti Silva
• Host Institution: Instituto de Ciência e Tecnologia (ICT). Universidade Federal de São Paulo (UNIFESP). Campus São José dos Campos. São José dos Campos , SP, Brazil

Abstract

The antistatic packages are used in the protection and packaging of boards, sensible integrated electronics components and integrated circuits. Polymeric materials used in development of antistatic packages have good mechanic properties and low electrical resistivity. Polyamide 6 (PA6)/ linear low density polyethylene (LLDPE) blends can be a good alternative to the development of antistatic packages. However, the PA6/LLDPE blend has high electrical resistivity and addition of anti-static agent, like the conductor black carbon, become necessary. In addition, the presence and the passage of humidity and/or little gas molecules across the polymer package provide risks to the packaged product. Therefore, the study of gases transport properties through the antistatic package becomes hugely important. In this project, antistatic packages using PA6/LLDPE blends-based black carbon nanocomposites will be developed. Nanocomposites with different contents of carbon black will be processed by extrusion process in a mini twin screw extruder and the thin films will be prepared. The permeability properties in water of the nanocomposites will be studied. The viability of this system will be evaluated using thermal, transport, mechanical and electrical characterization of the nanocomposites. (AU)