|Support type:||Scholarships in Brazil - Scientific Initiation|
|Effective date (Start):||February 01, 2020|
|Effective date (End):||March 31, 2021|
|Field of knowledge:||Engineering - Materials and Metallurgical Engineering - Nonmetallic Materials|
|Principal researcher:||Fabio Roberto Passador|
|Grantee:||Henrique Morales Zaggo|
|Home Institution:||Instituto de Ciência e Tecnologia (ICT). Universidade Federal de São Paulo (UNIFESP). Campus São José dos Campos. São José dos Campos , SP, Brazil|
Polymeric materials are widely used in the packaging industry due to their low density, low cost, and ease of processing. Polymer materials for the production of antistatic packaging for transport and storage of electronic devices demand good mechanical properties and low electrical resistivity. As most polymers are insulating, these materials accumulate electrical charges which can generate electrostatic discharges and, consequently, damage the packaged content. One way to improve antistatic characteristics is by adding conductive materials such as carbon black, carbon nanotubes (CNT) or graphite. Poly (trimethylene terephthalate) (PTT) is an aromatic polyester that presents mechanical properties that enable its use in the packaging industry. In this project, the feasibility of using PTT and residual graphite (RG) from aircraft parts disposals will be evaluated for the development of antistatic packaging for electronic components. The methodology consists in the preparation of PTT/graphite composites with different graphite contents (0; 1.0; 3.0; 5.0; 10 and 20 wt%) using the extrusion process in a mini twin extruder. In addition, the purification of RG and the use of a compatibilizer agent (maleic anhydride grafted PTT) will be studied for better dispersion and/or distribution of graphite in the polymeric matrix. Thin films of the composite materials will be prepared and characterized by their thermal, mechanical, morphological, electrical and water vapor transport properties for validation of these materials as antistatic packaging.