Development of three-dimensional lithographic process for application in integrated micro-optics.

Author(s)

Ricardo Tardelli Catelli

• Document type: Master's Dissertation
• Press: São Paulo.
• Institution: Universidade de São Paulo (USP). Escola Politécnica (EP/BC)
• Defense date: 2010-07-21

Examining board members

Antonio Carlos Seabra; Fernando Josepetti Fonseca; Stanislav Moshkalev

• Advisor: Antonio Carlos Seabra

Abstract

This work aims at developing an electron-beam lithography process for the fabrication of microoptical elements using the negative tone chemically amplified resist SU-8 on Si substrate. A study of the proximity effect parameters a, b and h is carried out to model and control the electron scattering both in the resist and in the substrate, and the SU-8 standard processing conditions are changed to achieve a low contrast process. The determination of the SU-8 / Si proximity effect parameters and its dependence with resist depth is done employing an experimental method and through Monte Carlo simulations. First, a, b and h are obtained comparing exposed patterns calculated by the software PROXY. b, the parameter which measures the backscattering of the electrons by the substrate, is equal to 4m and the value of h, the ratio of the dose contribution of backscattered electrons to that of the forward scattered (related to a), is 0.7. The extrapolation of exposed patterns data is used to estimate the scanning electron microscope beam diameter through the equation for low angle scattering (a = 128nm at the resist surface) and the lateral resolution of the process is determined (a = 800nm at the resist/ substrate interface, for a 2.4m film). With aid of the software CASINO, Monte Carlo simulations of the scattering trajectories of electrons in substrate and resist materials are calculated, recording the energy that they dissipate through collisions along their path. The results obtained representing the profile of the energy dissipated in the resist are used to determine the proximity effect parameters. The experimental method results are compared to that obtained by simulation. Regarding the SU-8 processing, the process parameters for the fabrication of three-dimensional structures by electron-beam lithography are determined. The process is designed to have specifications (thickness, contrast, sensitivity and surface roughness) suitable for microoptical elements fabrication. It begins with the determination of the SU-8 contrast curve and its sensitivity for specific post-exposure bake temperatures. A below the unit contrast process with high sensitivity (2C/cm2) is achieved postannealing the sample below the resist glass transition temperature. The film surface roughness is measured after resist development for different exposure doses, and a controlled hardbake (cure) and reflow is carried to enhance both the mechanical properties and the surface roughness of the structures that will remain as part of the final device. A RMS roughness of 40nm, lower than 20 times the wavelength of consumer electronics laser diode, is obtained. The electron-beam process designed is applied to the fabrication of a microelement with a 16-level profile discretization. (AU)