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José Eduardo Spinelli

CV Lattes GoogleMyCitations ResearcherID ORCID


Universidade Federal de São Carlos (UFSCAR). Centro de Ciências Exatas e de Tecnologia (CCET)  (Institutional affiliation for the last research proposal)
Birthplace: Brazil

graduate at Engenharia Mecânica from Universidade Estadual Paulista Júlio de Mesquita Filho (1998), master's at Mechanical Engineering from Universidade Estadual de Campinas (2000) and PhD. at Mechanical Engineering from Universidade Estadual de Campinas (2005). Has experience in Material and Metallurgical Engineering, focusing on Casting, acting on the following subjects: directional unsteady-state solidification, microstructure, dendrite arm spacings, al-si alloys and corrosion resistance. (Source: Lattes Curriculum)

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Scholarships abroad
FAPESP support in numbers * Updated April 10, 2021
Total / Available in English
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Keywords used by the researcher
Scientific publications resulting from Research Grants and Scholarships under the grantee's responsibility (73)

(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)

Publications71
Citations410
Cit./Article5.8
Data from Web of Science

VERISSIMO, NATHALIA C.; BRITO, CRYSTOPHER; SANTOS, WASHINGTON L. R.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Interconnection of Zn content, macrosegregation, dendritic growth, nature of intermetallics and hardness in directionally solidified Mg-Zn alloys. Journal of Alloys and Compounds, v. 662, p. 1-10, . Web of Science Citations: 16. (13/23396-7, 14/50502-5, 12/08494-0)

SILVA, BISMARCK LUIZ; BERTELLI, FELIPE; CANTE, MANUEL V.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Solder/substrate interfacial thermal conductance and wetting angles of Bi-Ag solder alloys. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 27, n. 2, p. 1994-2003, . Web of Science Citations: 7. (13/13030-5, 13/08259-3)

MORENO, GUSTAVO R.; SILVA, BISMARCK L.; BOGNO, ABDOUL-AZIZ; HENEIN, HANI; SPINELLI, JOSE E.. Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys. Journal of Alloys and Compounds, v. 680, p. 259-267, . Web of Science Citations: 5. (13/50375-0)

FREITAS, EMMANUELLE S.; OSORIO, WISLEI R.; SPINELLI, JOSE E.; GARCIA, AMAURI. Mechanical and corrosion resistances of a Sn-0.7 wt.%Cu lead-free solder alloy. MICROELECTRONICS RELIABILITY, v. 54, n. 6-7, p. 1392-1400, . Web of Science Citations: 22. (13/13030-5, 13/15478-3)

OSORIO, WISLEI R.; FREITAS, EMMANUELLE S.; SPINELLI, JOSE E.; GARCIA, AMAURI. Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution. Corrosion Science, v. 80, p. 71-81, . Web of Science Citations: 20. (13/15478-3)

SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluation of solder/substrate thermal conductance and wetting angle of Sn-0.7 wt%Cu-(0-0.1 wt%Ni) solder alloys. Materials Letters, v. 142, p. 163-167, . Web of Science Citations: 20. (13/13030-5, 13/08259-3)

SILVA, BISMARCK LUIZ; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys. Journal of Alloys and Compounds, v. 691, p. 600-605, . Web of Science Citations: 18. (15/11863-5, 13/08259-3)

SILVA, BISMARCK LUIZ; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn-Zn-Cu Solder Alloy. ACTA METALLURGICA SINICA-ENGLISH LETTERS, v. 30, n. 6, p. 528-540, . Web of Science Citations: 3. (15/11863-5, 13/08259-3)

SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 8, n. 1, p. 1581-1586, . Web of Science Citations: 1. (17/12741-6)

DIAS, MARCELINO; COSTA, THIAGO A.; SOARES, THIAGO; SILVA, BISMARCK L.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 47, n. 2, p. 1647-1657, . Web of Science Citations: 0. (13/09267-0, 17/15158-0, 16/18186-1)

EVANGELISTA DA SILVA, VITOR COVRE; DE GOUVEIA, GUILHERME LISBOA; VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions. JOURNAL OF ELECTRONIC MATERIALS, v. 48, n. 8, p. 4773-4788, . Web of Science Citations: 0. (17/12741-6)

LIMA, THIAGO SOARES; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying Al levels. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS, v. 233, n. 9, p. 1733-1737, . Web of Science Citations: 1. (16/10596-6, 17/12741-6, 15/11863-5, 17/15158-0)

SILVA, BISMARCK L.; XAVIER, MARCELLA G. C.; GARCIA, AMAMI; SPINENLLI, JOSE E.. Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 705, p. 325-334, . Web of Science Citations: 9. (16/10596-6, 15/11863-5)

SILVA, BISMARCK LUIZ; DESSI, JOAO GUILHERME; GOMES, LEONARDO FERNANDES; PERES, MAURICIO MIRDHAUI; CANTE, MANUEL VENCESLAU; SPINELLI, JOSE EDUARDO. Assessing microstructures and mechanical resistances of as-atomized and as-extruded samples of Al-1wt%Fe-1wt%Ni alloy. Journal of Alloys and Compounds, v. 691, p. 952-960, . Web of Science Citations: 2. (15/11863-5, 13/08259-3)

BRITO, CRYSTOPHER; VIDA, TALITA; FREITAS, EMMANUELLE; CHEUNG, NOE; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Cellular/dendritic arrays and intermetallic phases affecting corrosion and mechanical resistances of an Al-Mg-Si alloy. Journal of Alloys and Compounds, v. 673, p. 220-230, . Web of Science Citations: 24. (14/50502-5, 12/08494-0, 13/15478-3, 14/25809-0, 13/23396-7)

PAIXAO, JEVERTON LAUREANO; GOMES, LEONARDO FERNANDES; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ. Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys. MATERIALS CHARACTERIZATION, v. 166, . Web of Science Citations: 0. (17/12741-6)

DIAS, MARCELINO; OLIVEIRA, RICARDO; KAKITANI, RAFAEL; CHEUNG, NOE; HENEIN, HANI; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Effects of solidification thermal parameters and Bi doping on silicon size, morphology and mechanical properties of Al-15wt.% Si-3.2wt.% Bi and Al-18wt.% Si-3.2wt.% Bi alloys. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 9, n. 3, p. 3460-3470, . Web of Science Citations: 0. (18/11791-2, 17/12741-6)

GOMES, LEONARDO FERNANDES; SILVA, BISMARCK LUIZ; DA SILVA, JR., PAULO SERGIO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Ag-containing aluminum-silicon alloys as an alternative for as-cast components of electric vehicles. MATERIALS RESEARCH EXPRESS, v. 8, n. 1, . Web of Science Citations: 0. (19/23673-7)

GOUVEIA, GUILHERME L.; GOMES, LEONARDO F.; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE E.. Mechanical Properties, Microstructural Features, and Correlations with Solidification Rates of Al-Cu-Si Ultrafine Eutectic Alloys. ADVANCED ENGINEERING MATERIALS, . Web of Science Citations: 0. (19/23673-7, 19/01432-8)

SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Sn-0.7 wt%Cu-(xNi) alloys: Microstructure-mechanical properties correlations with solder/substrate interfacial heat transfer coefficient. Journal of Alloys and Compounds, v. 632, p. 274-285, . Web of Science Citations: 19. (13/13030-5, 13/08259-3)

SILVA, BISMARCK LUIZ; SPINELLI, JOSE EDUARDO; CANTE, MANUEL V.; BERTELLI, FELIPE; CHEUNG, NOE; RIVA, RUDIMAR; GARCIA, AMAURI. Experimental and numerical analyses of laser remelted Sn-0.7 wt% Cu solder surfaces. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 26, n. 5, p. 3100-3107, . Web of Science Citations: 0. (13/13030-5, 12/16328-2)

COSTA, T. A.; MOREIRA, A. L.; MOUTINHO, D. J.; DIAS, M.; FERREIRA, I. L.; SPINELLI, J. E.; ROCHA, O. L.; GARCIA, A.. Growth direction and Si alloying affecting directionally solidified structures of Al-Cu-Si alloys. MATERIALS SCIENCE AND TECHNOLOGY, v. 31, n. 9, p. 1103-1112, . Web of Science Citations: 23. (13/23396-7, 13/09267-0)

SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn-Bi-(Cu,Ag) solder alloys. MATERIALS CHARACTERIZATION, v. 114, p. 30-42, . Web of Science Citations: 14. (13/13030-5, 13/08259-3)

SANTOS, WASHINGTON L. R.; BRITO, CRYSTOPHER; QUARESMA, JOSE M. V.; SPINELLI, JOSE E.; GARCIA, AMAURI. Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy. MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, v. 182, p. 29-36, . Web of Science Citations: 16. (12/08494-0)

SANTOS, WASHINGTON L. R.; SILVA, BISMARCK L.; BERTELLI, FELIPE; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. An alternative thermal approach to evaluate the wettability of solder alloys. APPLIED THERMAL ENGINEERING, v. 107, p. 431-440, . Web of Science Citations: 6. (15/11863-5)

SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI. The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloys. MATERIALS CHARACTERIZATION, v. 96, p. 115-125, . Web of Science Citations: 7. (13/13030-5, 13/08259-3)

SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 25, n. 1, p. 478-486, . Web of Science Citations: 11. (10/17057-7)

REYES, V, RODRIGO; CASTELETTI, LUIZ C.; GARCIA, AMAURI; SPINELLI, JOSE E.. Characterization of microstructure and wear resistance of a monotectic Al-Bi-Zn alloy. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, v. 147, . Web of Science Citations: 0. (17/12741-6)

CLEITON LUIZ PEREIRA; LEONARDO FERNANDES GOMES; JOSÉ EDUARDO SPINELLI. Effects of Bi Addition on Si Features, Tensile Properties and Wear Resistance of Hypereutectic Al-15Si Alloy. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 23, n. 2, p. -, . Web of Science Citations: 0. (17/12741-6)

SCHON, ALINE FERREIRA; REYES, RODRIGO VALENZUELA; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI; SILVA, BISMARCK LUIZ. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal of Alloys and Compounds, v. 809, . Web of Science Citations: 1. (17/12741-6)

XAVIER, MARCELLA G. C.; SOUZA, THAISA M. G.; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE E.. Effects of cobalt and solidification cooling rate on intermetallic phases and tensile properties of a -Cu, -Zn, -Fe containing Al-Si alloy. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, v. 107, n. 1-2, p. 717-730, . Web of Science Citations: 0. (17/12741-6)

XAVIER, MARCELLA G. C.; REYES, V, RODRIGO A.; GOMES, LEONARDO F.; SPINELLI, JOSE E.; MANGELINCK-NOEL, N.; NGUYEN-THI, HENRI; REINHART, GUILLAUME. Combined growth of alpha-Al and Bi in a Al-Bi-Cu monotectic alloy analyzed by in situ X-ray radiography. Journal of Crystal Growth, v. 536, . Web of Science Citations: 0. (17/12741-6)

GOMES, LEONARDO FERNANDES; DA SILVA, PAULO SERGIO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Effects of Silver Content and Cooling Rate on Electrical Conductivity and Tensile Properties of Al-Si(-Ag) Alloys. Journal of Materials Engineering and Performance, v. 29, n. 10, p. 6849-6860, . Web of Science Citations: 0. (17/12741-6)

SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; XAVIER, MARCELLA; LIMA, THIAGO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Interface evaluation of a Bi-Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v. 160, . Web of Science Citations: 0. (19/23673-7, 17/15158-0)

VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluating Microstructure, Wear Resistance and Tensile Properties of Al-Bi(-Cu, -Zn) Alloys for Lightweight Sliding Bearings. METALS, v. 11, n. 1, . Web of Science Citations: 0. (19/23673-7)

DONADONI, BRUNO; DE GOUVEIA, GUILHERME LISBOA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. A comparison of experimental time-secondary dendritic spacing and coarsening models for Al-Si-Cu alloys. JOURNAL OF MANUFACTURING PROCESSES, v. 54, p. 14-18, . Web of Science Citations: 0. (19/01432-8, 17/12741-6)

SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; SILVA, BISMARCK; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Microstructural and segregation effects affecting the corrosion behavior of a high-temperature Bi-Ag solder alloy in dilute chloride solution. Journal of Applied Electrochemistry, . Web of Science Citations: 0. (17/15158-0, 17/12741-6, 19/23673-7)

EVANGELISTA DA SILVA, VITOR COVRE; DE GOUVEIA, GUILHERME LISBOA; VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions. JOURNAL OF ELECTRONIC MATERIALS, v. 48, n. 8, p. 4773-4788, . Web of Science Citations: 0. (17/12741-6)

LIMA, THIAGO SOARES; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying Al levels. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS, v. 233, n. 9, p. 1733-1737, . Web of Science Citations: 1. (15/11863-5, 17/15158-0, 17/12741-6, 16/10596-6)

SANTOS, WASHINGTON L. R.; CRUZ, CLARISSA B.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Tailoring microstructure, tensile properties and fracture process via transient directional solidification of Zn-Sn alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 712, p. 127-132, . Web of Science Citations: 5. (17/15158-0, 17/12741-6, 16/10596-6)

REYES, RODRIGO V.; BELLO, THOMAS S.; KAKITANI, RAFAEL; COSTA, THIAGO A.; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Tensile properties and related microstructural aspects of hypereutectic Al-Si alloys directionally solidified under different melt superheats and transient heat flow conditions. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 685, p. 235-243, . Web of Science Citations: 22. (15/03116-5, 15/11863-5)

DIAS, MARCELINO; COSTA, THIAGO; ROCHA, OTAVIO; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn-Sb lead-free solder alloys. MATERIALS CHARACTERIZATION, v. 106, p. 52-61, . Web of Science Citations: 12. (13/23396-7, 13/09267-0)

SILVA, BISMARCK LUIZ; REINHART, GUILLAUME; NGUYEN-THI, HENRI; MANGELINCK-NOEL, NATHALIE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn-Bi solder alloy. MATERIALS CHARACTERIZATION, v. 107, p. 43-53, . Web of Science Citations: 22. (13/13030-5, 13/08259-3)

SANTOS, WASHINGTON L. R.; BRITO, CRYSTOPHER; BERTELLI, FELIPE; SPINELLI, JOSE E.; GARCIA, AMAURI. Microstructural development of hypoeutectic Zn-(10-40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness. Journal of Alloys and Compounds, v. 647, p. 989-996, . Web of Science Citations: 13. (12/08494-0, 13/13030-5, 12/16328-2)

SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; XAVIER, MARCELLA; LIMA, THIAGO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Interface evaluation of a Bi-Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v. 160, . Web of Science Citations: 0. (19/23673-7, 17/15158-0)

VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluating Microstructure, Wear Resistance and Tensile Properties of Al-Bi(-Cu, -Zn) Alloys for Lightweight Sliding Bearings. METALS, v. 11, n. 1, . Web of Science Citations: 0. (19/23673-7)

KAKITANI, RAFAEL; DE GOUVEIA, GUILHERME LISBOA; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Thermal analysis during solidification of an Al-Cu eutectic alloy: interrelation of thermal parameters, microstructure and hardness. JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, v. 137, n. 3, p. 983-996, . Web of Science Citations: 1. (17/12741-6)

SCALET ROSSINI, LUIS FELIPE; VALENZUELA REYES, RODRIGO ANDRE; SPINELLI, JOSE EDUARDO. Double-wire tandem GMAW welding process of HSLA50 steel. JOURNAL OF MANUFACTURING PROCESSES, v. 45, p. 227-233, . Web of Science Citations: 0. (17/12741-6)

SANTOS, WASHINGTON L. R.; CRUZ, CLARISSA B.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Tailoring microstructure, tensile properties and fracture process via transient directional solidification of Zn-Sn alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 712, p. 127-132, . Web of Science Citations: 5. (16/10596-6, 17/12741-6, 17/15158-0)

AFONSO, C. R. M.; VIDILLI, A. L.; SPINELLI, J. E.; RIVA, R.; AMIGO, V.; KIMINAMI, C. S.. An assessment of microstructure and properties of laser clad coatings of ultrafine eutectic beta Ti-Fe-Nb-Sn composite for implants. SURFACE & COATINGS TECHNOLOGY, v. 328, p. 161-171, . Web of Science Citations: 2. (15/19978-6, 15/17090-8, 13/05987-8)

SILVA, BISMARCK LUIZ; SPINELLI, JOSE EDUARDO; CANTE, MANUEL V.; BERTELLI, FELIPE; CHEUNG, NOE; RIVA, RUDIMAR; GARCIA, AMAURI. Experimental and numerical analyses of laser remelted Sn-0.7 wt% Cu solder surfaces. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 26, n. 5, p. 3100-3107, . Web of Science Citations: 0. (13/13030-5, 12/16328-2)

SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 25, n. 1, p. 478-486, . Web of Science Citations: 11. (10/17057-7)

SANTOS, WASHINGTON L. R.; SILVA, BISMARCK L.; BERTELLI, FELIPE; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. An alternative thermal approach to evaluate the wettability of solder alloys. APPLIED THERMAL ENGINEERING, v. 107, p. 431-440, . Web of Science Citations: 6. (15/11863-5)

SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI. The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloys. MATERIALS CHARACTERIZATION, v. 96, p. 115-125, . Web of Science Citations: 7. (13/13030-5, 13/08259-3)

SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn-Bi-(Cu,Ag) solder alloys. MATERIALS CHARACTERIZATION, v. 114, p. 30-42, . Web of Science Citations: 14. (13/13030-5, 13/08259-3)

PAIXAO, JEVERTON LAUREANO; GOMES, LEONARDO FERNANDES; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ. Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys. MATERIALS CHARACTERIZATION, v. 166, . Web of Science Citations: 0. (17/12741-6)

DIAS, MARCELINO; OLIVEIRA, RICARDO; KAKITANI, RAFAEL; CHEUNG, NOE; HENEIN, HANI; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Effects of solidification thermal parameters and Bi doping on silicon size, morphology and mechanical properties of Al-15wt.% Si-3.2wt.% Bi and Al-18wt.% Si-3.2wt.% Bi alloys. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 9, n. 3, p. 3460-3470, . Web of Science Citations: 0. (18/11791-2, 17/12741-6)

GOMES, LEONARDO FERNANDES; SILVA, BISMARCK LUIZ; DA SILVA, JR., PAULO SERGIO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Ag-containing aluminum-silicon alloys as an alternative for as-cast components of electric vehicles. MATERIALS RESEARCH EXPRESS, v. 8, n. 1, . Web of Science Citations: 0. (19/23673-7)

GOUVEIA, GUILHERME L.; GOMES, LEONARDO F.; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE E.. Mechanical Properties, Microstructural Features, and Correlations with Solidification Rates of Al-Cu-Si Ultrafine Eutectic Alloys. ADVANCED ENGINEERING MATERIALS, . Web of Science Citations: 0. (19/01432-8, 19/23673-7)

SOARES, THIAGO; CRUZ, CLARISSA; XAVIER, MARCELLA; REYES, V, RODRIGO; BERTELLI, FELIPE; GARCIA, AMAURI; SPINELLI, JOSE E.; CHEUNG, NOE. Interfacial heat transfer and microstructural analyses of a Bi-5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates. Journal of Alloys and Compounds, v. 860, . Web of Science Citations: 0. (19/23673-7, 17/15158-0)

Academic Publications

(References retrieved automatically from State of São Paulo Research Institutions)

SPINELLI, José Eduardo. Influência da convecção no líquido nas variáveis térmicas e estruturais na solidificação descendente de ligas Sn-Pb.  169 f. Tese (Doutorado) -  Faculdade de Engenharia Mecânica.  Universidade Estadual de Campinas (UNICAMP).  Campinas.  (02/00527-4

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