graduate at Engenharia Mecânica from Universidade Estadual Paulista Júlio de Mesquita Filho (1998), master's at Mechanical Engineering from Universidade Estadual de Campinas (2000) and PhD. at Mechanical Engineering from Universidade Estadual de Campinas (2005). Has experience in Material and Metallurgical Engineering, focusing on Casting, acting on the following subjects: directional unsteady-state solidification, microstructure, dendrite arm spacings, al-si alloys and corrosion resistance. (Source: Lattes Curriculum)
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During recycling of Al alloys, the accumulation of residual impurities, Fe in particular, often leads to the formation of coarse intermetallic compounds during solidification that degrade the mechanical properties of the final product. Knowing the high cost associated with reducing the Fe content and/or using thermomechanical processing to reduce the intermetallics, it is preferable to ma…
Professor Hani Henein is affiliated with the University of Alberta, where he is actively engaged in teaching and conducting research focused on pipeline steels, metal-matrix composites, and rapid solidification. He collaborates extensively with industry for research purposes and maintains robust international partnerships. As part of his mentorship initiatives, Hani established a program …
The present purpose aims to investigate research gaps identified in two important sectors of industry. Firstly, solidification of Sn-Bi(-In) solder alloys must be examined in copper substrates. In this case, the focus will be at the formed interfaces as a result of either solidification or localized reactions at the interface. This project will propose techniques in order to optimize the …
Ultrafine structured metals have been investigated in recent years. Their remarkable high strength may contrast with conventional coarse-structured materials. However, applications of these alloys containing high Cu and Si contents become limited due to their low plasticity. Recently, combinations of bimodal ultrafine eutectics (i.e., a ternary eutectic matrix (Al+Al2Cu+Si) with a dispers…
(Only some records are available in English at this moment)
Al-Sn based alloys are classified as self-lubricating alloys with excellent potential for applications such as bearing bushes. The development of new alloys is ongoing research and involves modifying the base alloy with alloying elements. The goal is to increase both mechanical strength and wear resistance, or at least enhance one without reducing the other. Cu is a commonly used mechanic…
The increase in the density of integrated circuit components resulting from the continuous miniaturization of electronic devices that populate modern life presents a series of Engineering challenges. Among these challenges, the optimization of alloys intended for soldering of integrated circuit components remains very important. In this context, some alloys from the Sn-Bi system exhibit a…
The industrial rise of Mg began in the 20th century, driven by its military applications during the World Wars. After a decrease in demand, its usage resurged in the 1990's, particularly in the automotive, aerospace, electronics, and biomedical industrial sectors. Global Mg production peaked in 2019, fueled by continuous growth in global demand, and shows signs of further growth in the co…
(Only some records are available in English at this moment)
The addition of Ce in Al alloys, although not yet performed in commercial alloys, arouses great interest due to the possibilities of replacing the addition of Ni in Al-Si alloys. This is because Ce opens the possibility for the formation of second phases with superior thermal stability and, therefore, alloy with superior performance in applications at high temperatures, for example betwee…
This proposal aims to deepen the knowledge of Sn-Bi alloys modified with indium (In). Sn-Bi-In alloys have aroused interest as low melting soldering alloys in the sense of composing vertical packages of Si chips as well as serving as alloys for thermal joints, acting in the increase of heat dissipation in electronic systems of high power density. Understanding Sn-Bi-In alloys involves not…
The 6201 alloy is widely used in the transmission and distribution of electricity due to the combination of suitable mechanical properties with high electrical conductivity. Despite being a thermomechanically and thermally processed alloy, it previously undergoes melting and solidification stages. The as-cast microstructures formed after solidification may affect the mechanical properties…
(Only some records are available in English at this moment)
This proposal aims to deepen the understanding of the microstructures formed in the as-soldered Sn-Bi-In/Copper joints. Sn-Bi-In alloys are becoming alternative applications for thermal joints, also known as Thermal Interface Materials (TIM) in microelectronic circuitry. This is because with the routine increase in the power density of microelectronic components and consequent heat genera…
Some Mg alloys have been gaining attention due to the possibility of applications as absorbable biomedical devices. These materials have the ability, once applied to injured tissue in the form of a biomedical device, to undergo the corrosion process concomitantly with the healing process. The possibility of absorption of the material after the aid of the healing process can have a positiv…
Rapidly solidified Sn-based solder alloys can provide metallurgical features such as low segregation and fine intermetallic compounds (IMCs). These features can be obtained in a controlled way by Impulse Atomization that provides powders of various sizes corresponding to a variety of cooling rates and undercooling levels to which diverse microstructures and morphologies are associated. Su…
(Only some records are available in English at this moment)
| 1 / 1 | Ongoing research grants |
| 10 / 8 | Completed research grants |
| 5 / 5 | Ongoing scholarships in Brazil |
| 21 / 18 | Completed scholarships in Brazil |
| 6 / 5 | Completed scholarships abroad |
| 43 / 37 | All research grants and scholarships |
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CV Lattes
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