José Eduardo Spinelli
CV Lattes
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Universidade Federal de São Carlos (UFSCAR). Centro de Ciências Exatas e de Tecnologia (CCET) (Institutional affiliation for the last research proposal) Birthplace: Brazil
graduate at Engenharia Mecânica from Universidade Estadual Paulista Júlio de Mesquita Filho (1998), master's at Mechanical Engineering from Universidade Estadual de Campinas (2000) and PhD. at Mechanical Engineering from Universidade Estadual de Campinas (2005). Has experience in Material and Metallurgical Engineering, focusing on Casting, acting on the following subjects: directional unsteady-state solidification, microstructure, dendrite arm spacings, al-si alloys and corrosion resistance. (Source: Lattes Curriculum)
- Generation of ultrafine Al-Cu-Si eutectics alloys by containerless rapid solidification, AP.R
Abstract
Ultrafine structured metals have been investigated in recent years. Their remarkable high strength may contrast with conventional coarse-structured materials. However, applications of these alloys containing high Cu and Si contents become limited due to their low plasticity. Recently, combinations of bimodal ultrafine eutectics (i.e., a ternary eutectic matrix (Al+Al2Cu+Si) with a dispe...
- Application of experimental solidification techniques, characterization of microstructure and properties in the evaluation of eutectic and hypereutectic Al-base and Zn-base alloys, AP.R
Abstract
This research project is based on the application of various solidification techniques so that a large spectrum of cooling conditions could be generated from a certain molten alloy. The main purpose is to produce and examine a variety of microstructures for each metallic alloy and to determine properties of interest following processing characteristics. Understanding the microstructure ...
- Microstructure evaluation of ternary Al-Si-Cu, Sn-Bi-Sb and Zn-Sn-Cu and its correlations with mechanical properties, AP.R
Abstract
The operational characteristics regarding the foundry process can definitely affect the final microstructure. Such characteristics of the process can be translated by the solidification thermal variables such as cooling rate and growth rate. The use of lead (Pb) is a drawback in the modern soldering industry, which is justified based on the high toxicity of lead. As a consequence, sev...
- Microstructural analysis of Sn-Cu and Sn-Ag-Cu lead free solder alloys under fast and slow cooling, AP.R
Abstract
Part of the interest on replacing traditional Pb-based alloys remains on developing rapidly solidified powders (>100 K/s) with special characteristics, such as low melting point and well-distributed intermetallics. The basis of the ongoing project with FAPESP is not rapid solidification. However, the usage of techniques as those available in University of Alberta for rapid solidificatio...
- Microstructure, thermal parameters, segregation and mechanical properties of lead-free Sn-based, Zn-based and Bi-based solder alloys, AP.R
Abstract
New legislations have been continuously launched by the European Union (EU) in order to avoid the usage of hazardous substances on microelectronics. Other important countries like Japan and China have already adopted such restrictions. The specific element to be evaluated in the present proposal is lead (Pb), which is considered one of the six substances with higher toxic potential. Th...
(Only some records are available in English at this moment)
- Microstructure development, corrosion and mechanical resistances of Mg-Si and Mg-Si-(x) alloys for biomedical application, BP.DR
Abstract
Deeper understanding of the microstructure formation and evolution as a function of solidification settings may be attained by using Cu-mold rapid solidification as well as water-cooled directional solidification techniques. This is explained by the broad range of conditions which can be tested at this point. The examination of microstructure parameters such as grain size and morphology...
- Effects of silicon content and cooling rate on the solidification of hypereutectic Al-Si alloys, BP.IC
Abstract
Al hypereutectic alloys are characterized by high solute content. The chemistry must be higher than 12.0wt%Si. The commercial alloys like A390 are recognized as those which are the most used in order to produce automobile parts such as pistons, engine blocks and manifolds. Although the effects of eutectic and primary silicon modifiers such as Na, Ca, Sr, Sb and P on microstructure of th...
- Microstructural evaluation of SAC307 solder alloy sintered by microwaves, BP.IC
Abstract
The studies on processing of ceramics by microwaves in the last few years show unique characteristics involving the usage of this kind of energy under high temperatures. In the case of metals seems to be possible a reduction of energy consumption and a decrease on time of processing, beyond the imposition of an inverted distribution of temperature profile and a selective heating. The so...
- Assessing thermal and microstructural parameters of the Sn-40wt%Bi-2wt%Ag solder alloy, BP.IC
Abstract
New legislations have been continuously launched by the European Union (EU) in order to avoid the usage of hazardous substances on microelectronics. Other important countries like Japan and China have already adopted such restrictions. The specific element to be evaluated in the present proposal is lead (Pb), which is considered one of the six substances with higher toxic potential. Th...
(Only some records are available in English at this moment)
- Impulse Atomization of Sn-Zn and Al-Si alloys: correlations between microstructures/morphologies and processing parameters, BE.PQ
Abstract
Rapidly solidified Sn-based solder alloys can provide metallurgical features such as low segregation and fine intermetallic compounds (IMCs). These features can be obtained in a controlled way by Impulse Atomization that provides powders of various sizes corresponding to a variety of cooling rates and undercooling levels to which diverse microstructures and morphologies are associated. ...
- Microstructure and mechanical behavior of Sn-Bi-Cu and Sn-Bi-Ag lead-free solder alloys, BE.EP.DR
Abstract
Sn-Bi solder alloys seem to be promising for replacing traditional Pb-based alloys. Low melting point and low relative costs characterize such alternative alloys, which are quite important factors to be considered for applications in microelectronics. However, unsuitable mechanical properties and low wettability are some drawbacks faced by such alloys. Microadditions containing Ag and C...
- Laser cladding of high energy ball milled powder of nanocrystalline Ti-(Nb,Mo)-Fe-Sn alloys, BE.EP.IC
Abstract
The synthesis of new Ti-based nanocrystalline alloys has been carried out because of their good engineering properties. These alloys are industrially important as structural and functional materials. Ti-based BMG alloys exhibit high strength (1800-2500 MPa), low elastic modulus (90-110 GPa) and, as expected, good corrosion resistance in various solutions. The Ti-Fe-Co and Ti-Fe-Sn nanoc...
| 2 / 2 | Ongoing research grants |
| 5 / 4 | Completed research grants |
| 1 / 1 | Ongoing scholarships in Brazil |
| 14 / 11 | Completed scholarships in Brazil |
| 4 / 3 | Completed scholarships abroad |
| 26 / 21 | All research grants and scholarships |
| Associated processes | |
(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)
| Publications | 45 |
| Citations | 319 |
| Cit./Article | 7.1 |
| Data from Web of Science | |
SILVA, BISMARCK LUIZ; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy. MICROELECTRONICS RELIABILITY, v. 54, n. 12, p. 2929-2934, DEC 2014. Web of Science Citations: 5.
GOMES, LEONARDO F.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Dendritic Growth, Solidification Thermal Parameters, and Mg Content Affecting the Tensile Properties of Al-Mg-1.5 Wt Pct Fe Alloys. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 48A, n. 4, p. 1841-1855, APR 2017. Web of Science Citations: 6.
FREITAS, EMMANUELLE S.; OSORIO, WISLEI R.; SPINELLI, JOSE E.; GARCIA, AMAURI. Mechanical and corrosion resistances of a Sn-0.7 wt.%Cu lead-free solder alloy. MICROELECTRONICS RELIABILITY, v. 54, n. 6-7, p. 1392-1400, JUN-JUL 2014. Web of Science Citations: 23.
SILVA, BISMARCK LUIZ; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys. Journal of Alloys and Compounds, v. 691, p. 600-605, JAN 15 2017. Web of Science Citations: 18.
SILVA, BISMARCK LUIZ; REINHART, GUILLAUME; NGUYEN-THI, HENRI; MANGELINCK-NOEL, NATHALIE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn-Bi solder alloy. MATERIALS CHARACTERIZATION, v. 107, p. 43-53, SEP 2015. Web of Science Citations: 23.
SANTOS, WASHINGTON L. R.; BRITO, CRYSTOPHER; BERTELLI, FELIPE; SPINELLI, JOSE E.; GARCIA, AMAURI. Microstructural development of hypoeutectic Zn-(10-40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness. Journal of Alloys and Compounds, v. 647, p. 989-996, OCT 25 2015. Web of Science Citations: 17.
SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; GARCIA, AMAURI. Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 43, n. 5, p. 1347-1361, MAY 2014. Web of Science Citations: 16.
FREITAS, EMMANUELLE S.; SILVA, ADRINA P.; SPINELLI, JOSE E.; CASTELETTI, LUIZ C.; GARCIA, AMAURI. Inter-relation of Microstructural Features and Dry Sliding Wear Behavior of Monotectic Al-Bi and Al-Pb Alloys. TRIBOLOGY LETTERS, v. 55, n. 1, p. 111-120, JUL 2014. Web of Science Citations: 14.
SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluation of solder/substrate thermal conductance and wetting angle of Sn-0.7 wt%Cu-(0-0.1 wt%Ni) solder alloys. Materials Letters, v. 142, p. 163-167, MAR 1 2015. Web of Science Citations: 21.
BOGNO, ABDOUL-AZIZ; SPINELLI, JOSE EDUARDO; MOREIRA AFONSO, CONRADO RAMOS; HENEIN, HANI. Microstructural and mechanical properties analysis of extruded Sn-0.7Cu solder alloy. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 4, n. 1, p. 84-92, JAN-MAR 2015. Web of Science Citations: 8.
SILVA, BISMARCK LUIZ; EVANGELISTA DA SILVA, VITOR COVRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys. Journal of Electronic Materials, v. 46, n. 3, p. 1754-1769, MAR 2017. Web of Science Citations: 9.
SILVA, BISMARCK LUIZ; BERTELLI, FELIPE; CANTE, MANUEL V.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Solder/substrate interfacial thermal conductance and wetting angles of Bi-Ag solder alloys. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 27, n. 2, p. 1994-2003, FEB 2016. Web of Science Citations: 8.
REYES, RODRIGO V.; KAKITANI, RAFAEL; COSTA, THIAGO A.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Cooling thermal parameters, microstructural spacing and mechanical properties in a directionally solidified hypereutectic Al-Si alloy. PHILOSOPHICAL MAGAZINE LETTERS, v. 96, n. 6, p. 228-237, 2016. Web of Science Citations: 8.
SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; GARCIA, AMAURI. Microstructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications. MATERIALS & DESIGN, v. 58, p. 482-490, JUN 2014. Web of Science Citations: 23.
CANTE, V, MANUEL; LIMA, THIAGO S.; BRITO, CRYSTOPHER; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. An Alternative to the Recycling of Fe-Contaminated Al. JOURNAL OF SUSTAINABLE METALLURGY, v. 4, n. 3, p. 412-426, SEP 2018. Web of Science Citations: 1.
XAVIER, MARCELLA G. C.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. ADVANCED ENGINEERING MATERIALS, v. 20, n. 7, JUL 2018. Web of Science Citations: 0.
GOMES, LEONARDO F.; SPINELLI, J. E.; BOGNO, A-A; GALLERNEAULT, M.; HENEIN, H.. Influence of annealing treatment on Si morphology and strength of rapid solidified Al-12 wt% Si powders. Journal of Alloys and Compounds, v. 785, p. 1077-1085, MAY 15 2019. Web of Science Citations: 0.
LIMA, THIAGO SOARES; DE GOUVEIA, GUILHERME LISBOA; SEPTIMIO, RUDIMYLLA DA SILVA; DA CRUZ, CLARISSA BARROS; SILVA, BISMARCK LUIZ; BRITO, CRYSTOPHER; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. METALS, v. 9, n. 2, FEB 2019. Web of Science Citations: 0.
SCHON, ALINE FERREIRA; REYES, RODRIGO VALENZUELA; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI; SILVA, BISMARCK LUIZ. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal of Alloys and Compounds, v. 809, NOV 15 2019. Web of Science Citations: 0.
SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 8, n. 1, p. 1581-1586, JAN-MAR 2019. Web of Science Citations: 1.
REYES, RODRIGO V.; BELLO, THOMAS S.; KAKITANI, RAFAEL; COSTA, THIAGO A.; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Tensile properties and related microstructural aspects of hypereutectic Al-Si alloys directionally solidified under different melt superheats and transient heat flow conditions. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 685, p. 235-243, FEB 8 2017. Web of Science Citations: 20.
SPINELLI, J. E.; BOGNO, A. -A.; HENEIN, H.. Two-Zone Microstructures in Al-18Si Alloy Powders. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 49A, n. 2, p. 550-562, FEB 2018. Web of Science Citations: 3.
KAKITANI, RAFAEL; REYES, RODRIGO V.; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Effects of Melt Superheating on the Microstructure and Tensile Properties of a Ternary Al-15 Wt Pct Si-1.5 Wt Pct Mg Alloy. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 50A, n. 3, p. 1308-1322, MAR 2019. Web of Science Citations: 0.
REYES, RODRIGO V.; PINOTTI, VITOR E.; AFONSO, CONRADO R. M.; CASTELETTI, LUIZ C.; GARCIA, AMAURI; SPINELLI, JOSE E.. Processing, As-Cast Microstructure and Wear Characteristics of a Monotectic Al-Bi-Cu Alloy. Journal of Materials Engineering and Performance, v. 28, n. 2, SI, p. 1201-1212, FEB 2019. Web of Science Citations: 0.
MORENO, GUSTAVO R.; SILVA, BISMARCK L.; BOGNO, ABDOUL-AZIZ; HENEIN, HANI; SPINELLI, JOSE E.. Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys. Journal of Alloys and Compounds, v. 680, p. 259-267, SEP 25 2016. Web of Science Citations: 5.
DA CRUZ, CLARISSA BARROS; KAKITANI, RAFAEL; CAVALCANTE XAVIER, MARCELLA GAUTE; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 1, 2018. Web of Science Citations: 0.
SILVA, BISMARCK LUIZ; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn-Zn-Cu Solder Alloy. ACTA METALLURGICA SINICA-ENGLISH LETTERS, v. 30, n. 6, p. 528-540, JUN 2017. Web of Science Citations: 3.
SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 25, n. 1, p. 478-486, JAN 2014. Web of Science Citations: 11.
SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI. The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloys. MATERIALS CHARACTERIZATION, v. 96, p. 115-125, OCT 2014. Web of Science Citations: 7.
SANTOS, WASHINGTON L. R.; CRUZ, CLARISSA B.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Tailoring microstructure, tensile properties and fracture process via transient directional solidification of Zn-Sn alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 712, p. 127-132, JAN 18 2018. Web of Science Citations: 4.
REYES, RODRIGO V.; KAKITANI, RAFAEL; COSTA, THIAGO A.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Cooling thermal parameters, microstructural spacing and mechanical properties in a directionally solidified hypereutectic Al-Si alloy. PHILOSOPHICAL MAGAZINE LETTERS, v. 96, n. 6, p. 228-237, 2016. Web of Science Citations: 8.
SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; GARCIA, AMAURI. Microstructure, phases morphologies and hardness of a Bi-Ag eutectic alloy for high temperature soldering applications. MATERIALS & DESIGN, v. 58, p. 482-490, JUN 2014. Web of Science Citations: 23.
CANTE, V, MANUEL; LIMA, THIAGO S.; BRITO, CRYSTOPHER; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. An Alternative to the Recycling of Fe-Contaminated Al. JOURNAL OF SUSTAINABLE METALLURGY, v. 4, n. 3, p. 412-426, SEP 2018. Web of Science Citations: 1.
XAVIER, MARCELLA G. C.; SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. High Cooling Rate, Regular and Plate Like Cells in Sn-Ni Solder Alloys. ADVANCED ENGINEERING MATERIALS, v. 20, n. 7, JUL 2018. Web of Science Citations: 0.
GOMES, LEONARDO F.; SPINELLI, J. E.; BOGNO, A-A; GALLERNEAULT, M.; HENEIN, H.. Influence of annealing treatment on Si morphology and strength of rapid solidified Al-12 wt% Si powders. Journal of Alloys and Compounds, v. 785, p. 1077-1085, MAY 15 2019. Web of Science Citations: 0.
LIMA, THIAGO SOARES; DE GOUVEIA, GUILHERME LISBOA; SEPTIMIO, RUDIMYLLA DA SILVA; DA CRUZ, CLARISSA BARROS; SILVA, BISMARCK LUIZ; BRITO, CRYSTOPHER; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses. METALS, v. 9, n. 2, FEB 2019. Web of Science Citations: 0.
SCHON, ALINE FERREIRA; REYES, RODRIGO VALENZUELA; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI; SILVA, BISMARCK LUIZ. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal of Alloys and Compounds, v. 809, NOV 15 2019. Web of Science Citations: 0.
SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 8, n. 1, p. 1581-1586, JAN-MAR 2019. Web of Science Citations: 1.
REYES, RODRIGO V.; BELLO, THOMAS S.; KAKITANI, RAFAEL; COSTA, THIAGO A.; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Tensile properties and related microstructural aspects of hypereutectic Al-Si alloys directionally solidified under different melt superheats and transient heat flow conditions. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 685, p. 235-243, FEB 8 2017. Web of Science Citations: 20.
SPINELLI, J. E.; BOGNO, A. -A.; HENEIN, H.. Two-Zone Microstructures in Al-18Si Alloy Powders. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 49A, n. 2, p. 550-562, FEB 2018. Web of Science Citations: 3.
KAKITANI, RAFAEL; REYES, RODRIGO V.; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Effects of Melt Superheating on the Microstructure and Tensile Properties of a Ternary Al-15 Wt Pct Si-1.5 Wt Pct Mg Alloy. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v. 50A, n. 3, p. 1308-1322, MAR 2019. Web of Science Citations: 0.
REYES, RODRIGO V.; PINOTTI, VITOR E.; AFONSO, CONRADO R. M.; CASTELETTI, LUIZ C.; GARCIA, AMAURI; SPINELLI, JOSE E.. Processing, As-Cast Microstructure and Wear Characteristics of a Monotectic Al-Bi-Cu Alloy. Journal of Materials Engineering and Performance, v. 28, n. 2, SI, p. 1201-1212, FEB 2019. Web of Science Citations: 0.
MORENO, GUSTAVO R.; SILVA, BISMARCK L.; BOGNO, ABDOUL-AZIZ; HENEIN, HANI; SPINELLI, JOSE E.. Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys. Journal of Alloys and Compounds, v. 680, p. 259-267, SEP 25 2016. Web of Science Citations: 5.
DA CRUZ, CLARISSA BARROS; KAKITANI, RAFAEL; CAVALCANTE XAVIER, MARCELLA GAUTE; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Transient Unidirectional Solidification, Microstructure and Intermetallics in Sn-Ni Alloys. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 21, n. 1, 2018. Web of Science Citations: 0.
SILVA, BISMARCK LUIZ; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn-Zn-Cu Solder Alloy. ACTA METALLURGICA SINICA-ENGLISH LETTERS, v. 30, n. 6, p. 528-540, JUN 2017. Web of Science Citations: 3.
(References retrieved automatically from State of São Paulo Research Institutions)
SPINELLI, José Eduardo. Influência da convecção no líquido nas variáveis térmicas e estruturais na solidificação descendente de ligas Sn-Pb. 2005. 169f. Tese (Doutorado) – Faculdade de Engenharia Mecânica. Universidade Estadual de Campinas (UNICAMP). Campinas.