CV Lattes
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Universidade Federal de São Carlos (UFSCAR). Centro de Ciências Exatas e de Tecnologia (CCET) (Institutional affiliation for the last research proposal) Birthplace: Brazil
graduate at Engenharia Mecânica from Universidade Estadual Paulista Júlio de Mesquita Filho (1998), master's at Mechanical Engineering from Universidade Estadual de Campinas (2000) and PhD. at Mechanical Engineering from Universidade Estadual de Campinas (2005). Has experience in Material and Metallurgical Engineering, focusing on Casting, acting on the following subjects: directional unsteady-state solidification, microstructure, dendrite arm spacings, al-si alloys and corrosion resistance. (Source: Lattes Curriculum)
The present purpose aims to investigate research gaps identified in two important sectors of industry. Firstly, solidification of Sn-Bi(-In) solder alloys must be examined in copper substrates. In this case, the focus will be at the formed interfaces as a result of either solidification or localized reactions at the interface. This project will propose techniques in order to optimize the …
Ultrafine structured metals have been investigated in recent years. Their remarkable high strength may contrast with conventional coarse-structured materials. However, applications of these alloys containing high Cu and Si contents become limited due to their low plasticity. Recently, combinations of bimodal ultrafine eutectics (i.e., a ternary eutectic matrix (Al+Al2Cu+Si) with a dispers…
This research project is based on the application of various solidification techniques so that a large spectrum of cooling conditions could be generated from a certain molten alloy. The main purpose is to produce and examine a variety of microstructures for each metallic alloy and to determine properties of interest following processing characteristics. Understanding the microstructure ev…
The operational characteristics regarding the foundry process can definitely affect the final microstructure. Such characteristics of the process can be translated by the solidification thermal variables such as cooling rate and growth rate. The use of lead (Pb) is a drawback in the modern soldering industry, which is justified based on the high toxicity of lead. As a consequence, sever…
(Only some records are available in English at this moment)
Deeper understanding of the microstructure formation and evolution as a function of solidification settings may be attained by using Cu-mold rapid solidification as well as water-cooled directional solidification techniques. This is explained by the broad range of conditions which can be tested at this point. The examination of microstructure parameters such as grain size and morphology/d…
Brazil's niobium (Nb) reserves are the largest in the world as well as Brazil may be considered one of the largest producers of aluminum (Al). These facts, associated with the lack of investigations devoted to the effects of Nb in Al alloys, bring a suitable scenario for developing research in such topics. Nb has been recently developed to be used as a grain refiner in conjunction with bo…
Additive Manufacturing (AM) is an appropriate name to describe the technologies that build 3D objects by adding layer-upon-layer of material. One of the most common processes is Laser Powder Bed Fusion - LPBF. Among various melting technologies emerging as promising for new markets, AM is one of them requiring most for solidification understanding related to the process. The AlSi10Mg allo…
The performance of Mg-Si alloys is affected by both microstructure features and morphology of the Mg2Si phase. Some of the containing-Si Mg alloys of interest (either binary or ternary chemistries) show high proportion of eutectic constituting the microstructure. As such, eutectic size, distribution and morphology are aspects to be evaluated in a coupled way with the form of the Mg-rich m…
(Only some records are available in English at this moment)
Rapidly solidified Sn-based solder alloys can provide metallurgical features such as low segregation and fine intermetallic compounds (IMCs). These features can be obtained in a controlled way by Impulse Atomization that provides powders of various sizes corresponding to a variety of cooling rates and undercooling levels to which diverse microstructures and morphologies are associated. Su…
Sn-Bi solder alloys seem to be promising for replacing traditional Pb-based alloys. Low melting point and low relative costs characterize such alternative alloys, which are quite important factors to be considered for applications in microelectronics. However, unsuitable mechanical properties and low wettability are some drawbacks faced by such alloys. Microadditions containing Ag and Cu …
The synthesis of new Ti-based nanocrystalline alloys has been carried out because of their good engineering properties. These alloys are industrially important as structural and functional materials. Ti-based BMG alloys exhibit high strength (1800-2500 MPa), low elastic modulus (90-110 GPa) and, as expected, good corrosion resistance in various solutions. The Ti-Fe-Co and Ti-Fe-Sn nanocry…
| 1 / 1 | Ongoing research grants |
| 7 / 6 | Completed research grants |
| 1 / 1 | Ongoing scholarships in Brazil |
| 17 / 14 | Completed scholarships in Brazil |
| 4 / 3 | Completed scholarships abroad |
| 30 / 25 | All research grants and scholarships |
| Associated processes | |
(References retrieved automatically from Web of Science and SciELO through information on FAPESP grants and their corresponding numbers as mentioned in the publications by the authors)
| Publications | 71 |
| Citations | 410 |
| Cit./Article | 5.8 |
| Data from Web of Science | |
VERISSIMO, NATHALIA C.; BRITO, CRYSTOPHER; SANTOS, WASHINGTON L. R.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Interconnection of Zn content, macrosegregation, dendritic growth, nature of intermetallics and hardness in directionally solidified Mg-Zn alloys. Journal of Alloys and Compounds, v. 662, p. 1-10, MAR 25 2016. Web of Science Citations: 16. (13/23396-7, 14/50502-5, 12/08494-0)
SILVA, BISMARCK LUIZ; BERTELLI, FELIPE; CANTE, MANUEL V.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Solder/substrate interfacial thermal conductance and wetting angles of Bi-Ag solder alloys. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 27, n. 2, p. 1994-2003, FEB 2016. Web of Science Citations: 7. (13/13030-5, 13/08259-3)
MORENO, GUSTAVO R.; SILVA, BISMARCK L.; BOGNO, ABDOUL-AZIZ; HENEIN, HANI; SPINELLI, JOSE E.. Microstructure-property relations in as-atomized and as-extruded Sn-Cu (-Ag) solder alloys. Journal of Alloys and Compounds, v. 680, p. 259-267, SEP 25 2016. Web of Science Citations: 5. (13/50375-0)
FREITAS, EMMANUELLE S.; OSORIO, WISLEI R.; SPINELLI, JOSE E.; GARCIA, AMAURI. Mechanical and corrosion resistances of a Sn-0.7 wt.%Cu lead-free solder alloy. MICROELECTRONICS RELIABILITY, v. 54, n. 6-7, p. 1392-1400, JUN-JUL 2014. Web of Science Citations: 22. (13/13030-5, 13/15478-3)
OSORIO, WISLEI R.; FREITAS, EMMANUELLE S.; SPINELLI, JOSE E.; GARCIA, AMAURI. Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaCl solution. Corrosion Science, v. 80, p. 71-81, MAR 2014. Web of Science Citations: 20. (13/15478-3)
SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluation of solder/substrate thermal conductance and wetting angle of Sn-0.7 wt%Cu-(0-0.1 wt%Ni) solder alloys. Materials Letters, v. 142, p. 163-167, MAR 1 2015. Web of Science Citations: 20. (13/13030-5, 13/08259-3)
SILVA, BISMARCK LUIZ; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys. Journal of Alloys and Compounds, v. 691, p. 600-605, JAN 15 2017. Web of Science Citations: 18. (15/11863-5, 13/08259-3)
SILVA, BISMARCK LUIZ; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Dendritic Growth, Eutectic Features and Their Effects on Hardness of a Ternary Sn-Zn-Cu Solder Alloy. ACTA METALLURGICA SINICA-ENGLISH LETTERS, v. 30, n. 6, p. 528-540, JUN 2017. Web of Science Citations: 3. (15/11863-5, 13/08259-3)
SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Wetting behavior of Sn-Ag-Cu and Sn-Bi-X alloys: insights into factors affecting cooling rate. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 8, n. 1, p. 1581-1586, JAN-MAR 2019. Web of Science Citations: 1. (17/12741-6)
DIAS, MARCELINO; COSTA, THIAGO A.; SOARES, THIAGO; SILVA, BISMARCK L.; CHEUNG, NOE; SPINELLI, JOSE E.; GARCIA, AMAURI. Tailoring Morphology and Size of Microstructure and Tensile Properties of Sn-5.5 wt.%Sb-1 wt.%(Cu,Ag) Solder Alloys. JOURNAL OF ELECTRONIC MATERIALS, v. 47, n. 2, p. 1647-1657, FEB 2018. Web of Science Citations: 0. (13/09267-0, 17/15158-0, 16/18186-1)
EVANGELISTA DA SILVA, VITOR COVRE; DE GOUVEIA, GUILHERME LISBOA; VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions. JOURNAL OF ELECTRONIC MATERIALS, v. 48, n. 8, p. 4773-4788, AUG 2019. Web of Science Citations: 0. (17/12741-6)
LIMA, THIAGO SOARES; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying Al levels. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS, v. 233, n. 9, p. 1733-1737, SEP 2019. Web of Science Citations: 1. (16/10596-6, 17/12741-6, 15/11863-5, 17/15158-0)
SILVA, BISMARCK L.; XAVIER, MARCELLA G. C.; GARCIA, AMAMI; SPINENLLI, JOSE E.. Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 705, p. 325-334, SEP 29 2017. Web of Science Citations: 9. (16/10596-6, 15/11863-5)
SILVA, BISMARCK LUIZ; DESSI, JOAO GUILHERME; GOMES, LEONARDO FERNANDES; PERES, MAURICIO MIRDHAUI; CANTE, MANUEL VENCESLAU; SPINELLI, JOSE EDUARDO. Assessing microstructures and mechanical resistances of as-atomized and as-extruded samples of Al-1wt%Fe-1wt%Ni alloy. Journal of Alloys and Compounds, v. 691, p. 952-960, JAN 15 2017. Web of Science Citations: 2. (15/11863-5, 13/08259-3)
BRITO, CRYSTOPHER; VIDA, TALITA; FREITAS, EMMANUELLE; CHEUNG, NOE; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Cellular/dendritic arrays and intermetallic phases affecting corrosion and mechanical resistances of an Al-Mg-Si alloy. Journal of Alloys and Compounds, v. 673, p. 220-230, JUL 15 2016. Web of Science Citations: 24. (14/50502-5, 12/08494-0, 13/15478-3, 14/25809-0, 13/23396-7)
PAIXAO, JEVERTON LAUREANO; GOMES, LEONARDO FERNANDES; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ. Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys. MATERIALS CHARACTERIZATION, v. 166, AUG 2020. Web of Science Citations: 0. (17/12741-6)
DIAS, MARCELINO; OLIVEIRA, RICARDO; KAKITANI, RAFAEL; CHEUNG, NOE; HENEIN, HANI; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Effects of solidification thermal parameters and Bi doping on silicon size, morphology and mechanical properties of Al-15wt.% Si-3.2wt.% Bi and Al-18wt.% Si-3.2wt.% Bi alloys. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 9, n. 3, p. 3460-3470, MAY-JUN 2020. Web of Science Citations: 0. (18/11791-2, 17/12741-6)
GOMES, LEONARDO FERNANDES; SILVA, BISMARCK LUIZ; DA SILVA, JR., PAULO SERGIO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Ag-containing aluminum-silicon alloys as an alternative for as-cast components of electric vehicles. MATERIALS RESEARCH EXPRESS, v. 8, n. 1, JAN 2021. Web of Science Citations: 0. (19/23673-7)
GOUVEIA, GUILHERME L.; GOMES, LEONARDO F.; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE E.. Mechanical Properties, Microstructural Features, and Correlations with Solidification Rates of Al-Cu-Si Ultrafine Eutectic Alloys. ADVANCED ENGINEERING MATERIALS, JAN 2021. Web of Science Citations: 0. (19/23673-7, 19/01432-8)
SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Sn-0.7 wt%Cu-(xNi) alloys: Microstructure-mechanical properties correlations with solder/substrate interfacial heat transfer coefficient. Journal of Alloys and Compounds, v. 632, p. 274-285, MAY 25 2015. Web of Science Citations: 19. (13/13030-5, 13/08259-3)
SILVA, BISMARCK LUIZ; SPINELLI, JOSE EDUARDO; CANTE, MANUEL V.; BERTELLI, FELIPE; CHEUNG, NOE; RIVA, RUDIMAR; GARCIA, AMAURI. Experimental and numerical analyses of laser remelted Sn-0.7 wt% Cu solder surfaces. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 26, n. 5, p. 3100-3107, MAY 2015. Web of Science Citations: 0. (13/13030-5, 12/16328-2)
COSTA, T. A.; MOREIRA, A. L.; MOUTINHO, D. J.; DIAS, M.; FERREIRA, I. L.; SPINELLI, J. E.; ROCHA, O. L.; GARCIA, A.. Growth direction and Si alloying affecting directionally solidified structures of Al-Cu-Si alloys. MATERIALS SCIENCE AND TECHNOLOGY, v. 31, n. 9, p. 1103-1112, MAY 2015. Web of Science Citations: 23. (13/23396-7, 13/09267-0)
SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn-Bi-(Cu,Ag) solder alloys. MATERIALS CHARACTERIZATION, v. 114, p. 30-42, APR 2016. Web of Science Citations: 14. (13/13030-5, 13/08259-3)
SANTOS, WASHINGTON L. R.; BRITO, CRYSTOPHER; QUARESMA, JOSE M. V.; SPINELLI, JOSE E.; GARCIA, AMAURI. Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy. MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, v. 182, p. 29-36, MAR 2014. Web of Science Citations: 16. (12/08494-0)
SANTOS, WASHINGTON L. R.; SILVA, BISMARCK L.; BERTELLI, FELIPE; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. An alternative thermal approach to evaluate the wettability of solder alloys. APPLIED THERMAL ENGINEERING, v. 107, p. 431-440, AUG 25 2016. Web of Science Citations: 6. (15/11863-5)
SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI. The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloys. MATERIALS CHARACTERIZATION, v. 96, p. 115-125, OCT 2014. Web of Science Citations: 7. (13/13030-5, 13/08259-3)
SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 25, n. 1, p. 478-486, JAN 2014. Web of Science Citations: 11. (10/17057-7)
REYES, V, RODRIGO; CASTELETTI, LUIZ C.; GARCIA, AMAURI; SPINELLI, JOSE E.. Characterization of microstructure and wear resistance of a monotectic Al-Bi-Zn alloy. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, v. 147, DEC 2020. Web of Science Citations: 0. (17/12741-6)
CLEITON LUIZ PEREIRA; LEONARDO FERNANDES GOMES; JOSÉ EDUARDO SPINELLI. Effects of Bi Addition on Si Features, Tensile Properties and Wear Resistance of Hypereutectic Al-15Si Alloy. MATERIALS RESEARCH-IBERO-AMERICAN JOURNAL OF MATERIALS, v. 23, n. 2, p. -, 2020. Web of Science Citations: 0. (17/12741-6)
SCHON, ALINE FERREIRA; REYES, RODRIGO VALENZUELA; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI; SILVA, BISMARCK LUIZ. Assessing microstructure and mechanical behavior changes in a Sn-Sb solder alloy induced by cooling rate. Journal of Alloys and Compounds, v. 809, NOV 15 2019. Web of Science Citations: 1. (17/12741-6)
XAVIER, MARCELLA G. C.; SOUZA, THAISA M. G.; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE E.. Effects of cobalt and solidification cooling rate on intermetallic phases and tensile properties of a -Cu, -Zn, -Fe containing Al-Si alloy. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, v. 107, n. 1-2, p. 717-730, MAR 2020. Web of Science Citations: 0. (17/12741-6)
XAVIER, MARCELLA G. C.; REYES, V, RODRIGO A.; GOMES, LEONARDO F.; SPINELLI, JOSE E.; MANGELINCK-NOEL, N.; NGUYEN-THI, HENRI; REINHART, GUILLAUME. Combined growth of alpha-Al and Bi in a Al-Bi-Cu monotectic alloy analyzed by in situ X-ray radiography. Journal of Crystal Growth, v. 536, APR 15 2020. Web of Science Citations: 0. (17/12741-6)
GOMES, LEONARDO FERNANDES; DA SILVA, PAULO SERGIO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Effects of Silver Content and Cooling Rate on Electrical Conductivity and Tensile Properties of Al-Si(-Ag) Alloys. Journal of Materials Engineering and Performance, v. 29, n. 10, p. 6849-6860, OCT 2020. Web of Science Citations: 0. (17/12741-6)
SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; XAVIER, MARCELLA; LIMA, THIAGO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Interface evaluation of a Bi-Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v. 160, FEB 2021. Web of Science Citations: 0. (19/23673-7, 17/15158-0)
VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluating Microstructure, Wear Resistance and Tensile Properties of Al-Bi(-Cu, -Zn) Alloys for Lightweight Sliding Bearings. METALS, v. 11, n. 1, JAN 2021. Web of Science Citations: 0. (19/23673-7)
DONADONI, BRUNO; DE GOUVEIA, GUILHERME LISBOA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. A comparison of experimental time-secondary dendritic spacing and coarsening models for Al-Si-Cu alloys. JOURNAL OF MANUFACTURING PROCESSES, v. 54, p. 14-18, JUN 2020. Web of Science Citations: 0. (19/01432-8, 17/12741-6)
SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; SILVA, BISMARCK; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Microstructural and segregation effects affecting the corrosion behavior of a high-temperature Bi-Ag solder alloy in dilute chloride solution. Journal of Applied Electrochemistry, FEB 2021. Web of Science Citations: 0. (17/15158-0, 17/12741-6, 19/23673-7)
EVANGELISTA DA SILVA, VITOR COVRE; DE GOUVEIA, GUILHERME LISBOA; VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions. JOURNAL OF ELECTRONIC MATERIALS, v. 48, n. 8, p. 4773-4788, AUG 2019. Web of Science Citations: 0. (17/12741-6)
LIMA, THIAGO SOARES; SILVA, BISMARCK LUIZ; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE EDUARDO. Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying Al levels. PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS, v. 233, n. 9, p. 1733-1737, SEP 2019. Web of Science Citations: 1. (15/11863-5, 17/15158-0, 17/12741-6, 16/10596-6)
SANTOS, WASHINGTON L. R.; CRUZ, CLARISSA B.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Tailoring microstructure, tensile properties and fracture process via transient directional solidification of Zn-Sn alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 712, p. 127-132, JAN 18 2018. Web of Science Citations: 5. (17/15158-0, 17/12741-6, 16/10596-6)
REYES, RODRIGO V.; BELLO, THOMAS S.; KAKITANI, RAFAEL; COSTA, THIAGO A.; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Tensile properties and related microstructural aspects of hypereutectic Al-Si alloys directionally solidified under different melt superheats and transient heat flow conditions. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 685, p. 235-243, FEB 8 2017. Web of Science Citations: 22. (15/03116-5, 15/11863-5)
DIAS, MARCELINO; COSTA, THIAGO; ROCHA, OTAVIO; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Interconnection of thermal parameters, microstructure and mechanical properties in directionally solidified Sn-Sb lead-free solder alloys. MATERIALS CHARACTERIZATION, v. 106, p. 52-61, AUG 2015. Web of Science Citations: 12. (13/23396-7, 13/09267-0)
SILVA, BISMARCK LUIZ; REINHART, GUILLAUME; NGUYEN-THI, HENRI; MANGELINCK-NOEL, NATHALIE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn-Bi solder alloy. MATERIALS CHARACTERIZATION, v. 107, p. 43-53, SEP 2015. Web of Science Citations: 22. (13/13030-5, 13/08259-3)
SANTOS, WASHINGTON L. R.; BRITO, CRYSTOPHER; BERTELLI, FELIPE; SPINELLI, JOSE E.; GARCIA, AMAURI. Microstructural development of hypoeutectic Zn-(10-40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness. Journal of Alloys and Compounds, v. 647, p. 989-996, OCT 25 2015. Web of Science Citations: 13. (12/08494-0, 13/13030-5, 12/16328-2)
SEPTIMIO, RUDIMYLLA; CRUZ, CLARISSA; XAVIER, MARCELLA; LIMA, THIAGO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; CHEUNG, NOE. Interface evaluation of a Bi-Zn eutectic solder alloy: Effects of different substrate materials on thermal contact conductance. INTERNATIONAL JOURNAL OF THERMAL SCIENCES, v. 160, FEB 2021. Web of Science Citations: 0. (19/23673-7, 17/15158-0)
VALENZUELA REYES, RODRIGO ANDRE; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Evaluating Microstructure, Wear Resistance and Tensile Properties of Al-Bi(-Cu, -Zn) Alloys for Lightweight Sliding Bearings. METALS, v. 11, n. 1, JAN 2021. Web of Science Citations: 0. (19/23673-7)
KAKITANI, RAFAEL; DE GOUVEIA, GUILHERME LISBOA; GARCIA, AMAURI; CHEUNG, NOE; SPINELLI, JOSE E.. Thermal analysis during solidification of an Al-Cu eutectic alloy: interrelation of thermal parameters, microstructure and hardness. JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, v. 137, n. 3, p. 983-996, AUG 2019. Web of Science Citations: 1. (17/12741-6)
SCALET ROSSINI, LUIS FELIPE; VALENZUELA REYES, RODRIGO ANDRE; SPINELLI, JOSE EDUARDO. Double-wire tandem GMAW welding process of HSLA50 steel. JOURNAL OF MANUFACTURING PROCESSES, v. 45, p. 227-233, SEP 2019. Web of Science Citations: 0. (17/12741-6)
SANTOS, WASHINGTON L. R.; CRUZ, CLARISSA B.; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. Tailoring microstructure, tensile properties and fracture process via transient directional solidification of Zn-Sn alloys. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v. 712, p. 127-132, JAN 18 2018. Web of Science Citations: 5. (16/10596-6, 17/12741-6, 17/15158-0)
AFONSO, C. R. M.; VIDILLI, A. L.; SPINELLI, J. E.; RIVA, R.; AMIGO, V.; KIMINAMI, C. S.. An assessment of microstructure and properties of laser clad coatings of ultrafine eutectic beta Ti-Fe-Nb-Sn composite for implants. SURFACE & COATINGS TECHNOLOGY, v. 328, p. 161-171, NOV 15 2017. Web of Science Citations: 2. (15/19978-6, 15/17090-8, 13/05987-8)
SILVA, BISMARCK LUIZ; SPINELLI, JOSE EDUARDO; CANTE, MANUEL V.; BERTELLI, FELIPE; CHEUNG, NOE; RIVA, RUDIMAR; GARCIA, AMAURI. Experimental and numerical analyses of laser remelted Sn-0.7 wt% Cu solder surfaces. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 26, n. 5, p. 3100-3107, MAY 2015. Web of Science Citations: 0. (13/13030-5, 12/16328-2)
SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Development of solidification microstructure and tensile mechanical properties of Sn-0.7Cu and Sn-0.7Cu-2.0Ag solders. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v. 25, n. 1, p. 478-486, JAN 2014. Web of Science Citations: 11. (10/17057-7)
SANTOS, WASHINGTON L. R.; SILVA, BISMARCK L.; BERTELLI, FELIPE; SPINELLI, JOSE E.; CHEUNG, NOE; GARCIA, AMAURI. An alternative thermal approach to evaluate the wettability of solder alloys. APPLIED THERMAL ENGINEERING, v. 107, p. 431-440, AUG 25 2016. Web of Science Citations: 6. (15/11863-5)
SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ; CHEUNG, NOE; GARCIA, AMAURI. The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi-Ag solder alloys. MATERIALS CHARACTERIZATION, v. 96, p. 115-125, OCT 2014. Web of Science Citations: 7. (13/13030-5, 13/08259-3)
SILVA, BISMARCK L.; GARCIA, AMAURI; SPINELLI, JOSE E.. Cooling thermal parameters and microstructure features of directionally solidified ternary Sn-Bi-(Cu,Ag) solder alloys. MATERIALS CHARACTERIZATION, v. 114, p. 30-42, APR 2016. Web of Science Citations: 14. (13/13030-5, 13/08259-3)
PAIXAO, JEVERTON LAUREANO; GOMES, LEONARDO FERNANDES; REYES, RODRIGO VALENZUELA; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO; SILVA, BISMARCK LUIZ. Microstructure characterization and tensile properties of directionally solidified Sn-52 wt% Bi-1wt% Sb and Sn-52wt% Bi-2wt% Sb alloys. MATERIALS CHARACTERIZATION, v. 166, AUG 2020. Web of Science Citations: 0. (17/12741-6)
DIAS, MARCELINO; OLIVEIRA, RICARDO; KAKITANI, RAFAEL; CHEUNG, NOE; HENEIN, HANI; SPINELLI, JOSE EDUARDO; GARCIA, AMAURI. Effects of solidification thermal parameters and Bi doping on silicon size, morphology and mechanical properties of Al-15wt.% Si-3.2wt.% Bi and Al-18wt.% Si-3.2wt.% Bi alloys. JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v. 9, n. 3, p. 3460-3470, MAY-JUN 2020. Web of Science Citations: 0. (18/11791-2, 17/12741-6)
GOMES, LEONARDO FERNANDES; SILVA, BISMARCK LUIZ; DA SILVA, JR., PAULO SERGIO; GARCIA, AMAURI; SPINELLI, JOSE EDUARDO. Ag-containing aluminum-silicon alloys as an alternative for as-cast components of electric vehicles. MATERIALS RESEARCH EXPRESS, v. 8, n. 1, JAN 2021. Web of Science Citations: 0. (19/23673-7)
GOUVEIA, GUILHERME L.; GOMES, LEONARDO F.; CHEUNG, NOE; GARCIA, AMAURI; SPINELLI, JOSE E.. Mechanical Properties, Microstructural Features, and Correlations with Solidification Rates of Al-Cu-Si Ultrafine Eutectic Alloys. ADVANCED ENGINEERING MATERIALS, JAN 2021. Web of Science Citations: 0. (19/01432-8, 19/23673-7)
SOARES, THIAGO; CRUZ, CLARISSA; XAVIER, MARCELLA; REYES, V, RODRIGO; BERTELLI, FELIPE; GARCIA, AMAURI; SPINELLI, JOSE E.; CHEUNG, NOE. Interfacial heat transfer and microstructural analyses of a Bi-5% Sb lead-free alloy solidified against Cu, Ni and low-C steel substrates. Journal of Alloys and Compounds, v. 860, APR 15 2021. Web of Science Citations: 0. (19/23673-7, 17/15158-0)
(References retrieved automatically from State of São Paulo Research Institutions)
SPINELLI, José Eduardo. Influência da convecção no líquido nas variáveis térmicas e estruturais na solidificação descendente de ligas Sn-Pb. 169 f. Tese (Doutorado) - Faculdade de Engenharia Mecânica. Universidade Estadual de Campinas (UNICAMP). Campinas. (02/00527-4)