Amauri Garcia

• Abstract

  The present project aims to investigate a known gap in the literature concerning alloys for thermal interface applications. It is the purpose of the project to study optimization techniques through solidification in order to design the microstructure and appropriate application properties such as mechanical and corrosion resistances of alloys for thermal interfaces applied for heat dissip…

  Characterization of microstructure and properties in the evaluation of alloys for thermal interface contact, AP.R

• Abstract

  A careful study, permitting correlations between microstructural parameters and mechanical, wear, corrosion and tribocorrosion behavior of metallic alloys to be established, is fundamental in the pre-programming of final properties of as-cast components. A number of alloys systems can be identified havíng alloys with significant potential for biomedical, tribological and solders applicati…

  Interrelation of thermal and microstructural solidification parameters and corrosion/tribocorrosion behavior of alloys for tribological, biomedical and solder applications, AP.R

• Abstract

  With the comprehension of microstructural parameters of alloys directionally solidified under transient heat flow conditions, it is possible to envisage components having better properties and higher lifetime. A careful study, permitting correlations between these microstructural parameters and mechanical, wear, corrosion and tribocorrosion behavior of metallic alloys to be established, i…

  Effects of solidification MicrostructureParameters of Aluminum-based multicomponent alloys (Al-Mg-Si; Al-Sn-Cu; Al-Zn-Mg) on the resistances to Corrosionand tribocorrosion degradation, AP.R

(Only some records are available in English at this moment)

• Abstract

  The microstructural characterization along the solidification process of metallic alloys is fundamental, since once understood the correlation between steps of the manufacturing process and characteristics of the final component, the attainment of appropriate properties can be previously planned. In this sense, functional relations permitting microstructural parameters and mechanical and …

  Microstructural evolution and mechanical and wear resistances of ternary Al-Bi-Si and Al-Bi-Ni alloys unidirectionally solidified, BP.PD

• Abstract

  With the comprehension of microstructural parameters of alloys directionally solidified under transient heat flow conditions, it is possible to envisage components having better properties and higher lifetime. A careful study, permitting correlations between these microstructural parameters and mechanical, wear, corrosion and tribocorrosion behavior of metallic alloys to be established, i…

  Interrelation of Solidification Thermal and Microstructural Parameters and Tribocorrosive Behavior of Al-Zn(Mg) e Zn-Mg Alloys, BP.PD

• Abstract

  Some particular metallic systems, which are characterized by invariant reactions such as eutectics, monotectics and peritectics, have been frequently investigated by the variety of microstructures that can be formed during solidification giving rise to increasingly practical applications of such alloys. With recent restrictions to the use of Pb in solder alloys, due to its toxicity, the s…

  Microstructural evolution in the transient solidification of monophasic and peritectic Sn-Sb solder alloys (and Sn-Sb-X) and in solder/substrate interfacial layers, BP.DR

(Only some records are available in English at this moment)

• Abstract

  The microstructural characterization along the solidification process of metallic alloys is fundamental, since once understood the correlation between steps of the manufacturing process and characteristics of the final component, the attainment of appropriate properties can be previously planned. In this sense, functional relations permitting microstructural parameters and mechanical and …

  Microstructural Evolution and Mechanical and Wear Resistances of Ternary Al-Bi-Si and Al-Bi-Ni alloys Unidirectionally Solidified, BE.EP.PD

• Abstract

  Some particular metallic systems, which are characterized by invariant reactions such as eutectics, monotectics and peritectics, have been frequently investigated by the variety of microstructures that can be formed during solidification giving rise to increasingly practical applications of such alloys. With recent restrictions to the use of Pb in solder alloys, due to its toxicity, the s…

  Microstructural Evolution in the Transient Solidification of Monophasic and Peritectic Sn-Sb Solder Alloys (and Sn-Sb-X) and in Solder/Substrate Interfacial Layers, BE.EP.DR

• Abstract

  The mechanical characteristics (strength under static and dynamic loading; wear resistance) and chemical characteristics (corrosion resistance) of as solidified metallic components depend on the microstructural arrangement, i.e. grain size and cellular and dendritic spacings; non-homogeneity of chemical composition; size, morphology and distribution of inclusions; porosity, etc. Additiona…

  Thermal and microstructural parameters in the transient solidification of Al-Mg and Al-Mg-Si alloys and correlation with mechanical and corrosion resistances, BE.EP.DR

(Only some records are available in English at this moment)