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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Metal/mold thermal conductance affecting ultrafine scale microstructures in aluminum eutectic alloys

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Author(s):
Kakitani, Rafael [1] ; Oliveira, Ricardo [1] ; Reyes, Rodrigo V. [2] ; Rodrigues, Adilson V. [3] ; Bertelli, Felipe [4] ; Garcia, Amauri [1] ; Spinelli, Jose E. [5] ; Cheung, Noe [1]
Total Authors: 8
Affiliation:
[1] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
[2] Univ Fed Sao Carlos, Grad Program Mat Sci & Engn, Sao Carlos, SP - Brazil
[3] Fed Inst Educ, Sci & Technol Sao Paulo, IFSP, BR-12903000 Braganca Paulista, SP - Brazil
[4] Univ Fed Sao Paulo, UNIFESP, Inst Marine Sci, BR-11070100 Santos, SP - Brazil
[5] Univ Fed Sao Carlos, Dept Mat Engn, UFSCar, BR-13565905 Sao Carlos, SP - Brazil
Total Affiliations: 5
Document type: Journal article
Source: CASE STUDIES IN THERMAL ENGINEERING; v. 26, AUG 2021.
Web of Science Citations: 0
Abstract

Ultra-thin microstructures of eutectic aluminum alloys have attracted attention due to their excellent mechanical properties. In this context, it is known that the massive production of industrial components may require adaptations in the processing routes with severe thermal control. Considering the benefits of molding applications, knowledge of proper conditions of the metal/mold interface is essential. The interfacial heat transfer efficiency controls the solidification kinetics and so the microstructure evolution. Furthermore, much of the existing work in this field involves the use of either water-cooled or massive copper molds. The goal is achieving moderate or fast cooling conditions and produce refined structures. In this sense, the association of the interfacial heat transfer coefficient, h, with desired microstructures can expand the application to other types of mold and process conditions. In this respect, the present research work applies a numerical mathematical model based on an inverse heat conduction problem (IHCP) for the solidification of relevant binary eutectic alloys, considered as priority for the production of ultrafine eutectics. It was demonstrated the compromise existing between the overall interfacial coefficient h(g) and the eutectic spacing for the Al-6.3 wt% Ni, Al-33 wt% Cu, Al-wt.12% Si and Al-1.0 wt% Co eutectic alloys. Expressions relating h(g) as a function of time (t) and h(g) versus the representative eutectic microstructural spacing (lambda) of each alloy are proposed. The h(g) vs lambda expressions allow inferring h(g) values necessary to induce the formation of ultrafine lambda values. (AU)

FAPESP's process: 19/23673-7 - Evaluation of alloys for thermal interface contact and for additive manufacturing
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants