Microstructural development and mechanical properties of lead-free solder Sn-Cu al...
Microstructure evaluation of ternary Al-Si-Cu, Sn-Bi-Sb and Zn-Sn-Cu and its corre...
Microstructure, thermal parameters, segregation and mechanical properties of lead-...
Influence of Ni addition on the thermal parameters during directional solidificati...
Evaluation of alloys for thermal interface contact and for additive manufacturing
Production of lead free nanocomposite solder by mechanical alloying
Microstructural Evolution in the Transient Solidification of Monophasic and Perite...