| Full text | |
| Author(s): |
Santos, Washington L. R.
;
Silva, Bismarck L.
;
Bertelli, Felipe
;
Spinelli, Jose E.
;
Cheung, Noe
;
Garcia, Amauri
Total Authors: 6
|
| Document type: | Journal article |
| Source: | APPLIED THERMAL ENGINEERING; v. 107, p. 431-440, AUG 25 2016. |
| Web of Science Citations: | 6 |
| Abstract | |
The aim of the work is to propose an alternative method to qualitatively evaluate the wettability of different alloys of a particular alloy system. The technique is based on a thermal approach supported by experimental/theoretical methodologies involving a directional solidification procedure and numerical simulations based on the solution of the inverse heat conduction problem (IHCP). The wettability strongly affects the heat ability to flow across the alloy/substrate interface during solidification, which is construed as a heat transfer coefficient (h(g)). Particularly, for the alloys used in soldering processes, the wettability plays an important role in the integrity of solder junctions, being a fundamental parameter for selecting the most appropriate solder composition. The experiments were carried out with high temperature Zn-Sn solder alloys (10, 20, 30 and 40 wt%Sn) in a solidification device in which heat is extracted only through a water-cooled steel bottom. Experimental thermal profiles collected during solidification are used as input data to solve the IHCP and determine expressions hg vs. time for each alloy examined, permitting a tendency of wettability to be established. In order to validate the wetting behavior indicated by the hg values, alloy/substrate contact angles (theta) were measured on a steel substrate using a goniometer. It is shown that both hg and theta indicate improvements in wettability with the decrease in the alloy Sn content. (C) 2016 Elsevier Ltd. All rights reserved. (AU) | |
| FAPESP's process: | 15/11863-5 - Microstructure evaluation of ternary Al-Si-Cu, Sn-Bi-Sb and Zn-Sn-Cu and its correlations with mechanical properties |
| Grantee: | José Eduardo Spinelli |
| Support Opportunities: | Regular Research Grants |