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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Sn-Bi(-Ga) TIM Alloys: Microstructure, Tensile Properties, Wettability and Interfacial Reactions

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Author(s):
Evangelista da Silva, Vitor Covre [1] ; de Gouveia, Guilherme Lisboa [1] ; Valenzuela Reyes, Rodrigo Andre [1] ; Garcia, Amauri [2] ; Spinelli, Jose Eduardo [1]
Total Authors: 5
Affiliation:
[1] Univ Fed Sao Carlos, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
[2] Univ Campinas UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
Total Affiliations: 2
Document type: Journal article
Source: JOURNAL OF ELECTRONIC MATERIALS; v. 48, n. 8, p. 4773-4788, AUG 2019.
Web of Science Citations: 0
Abstract

In the present study, the main purpose is to examine the quality of the interface formed between either binary Sn-Bi or ternary Sn-Bi-2wt.%Ga Thermal Interface MaterialTIM alloys and a copper (Cu) substrate. The characteristics of the formed intermetallic compound (IMC) films were analyzed in the as-soldered joints, as well as during isothermal heat treatments at 100 degrees C for long periods of time. Thermo-Calc computations were also used in return for a better comprehension of the mechanisms involved, including, for instance, those related to the presence of Ga within the interdendritic regions. This can be explained by the increase in the Ga-amount in the liquid-phase with the progress of solidification. In an effort to address the wettability issue, the contact angles between the molten alloy and the Cu substrate were also determined. Finally, tensile tests were performed in order to evaluate the effects of the minor Ga additions in the alloy's overall mechanical properties. Despite unsound alloy mechanical properties, gallium (Ga) additions effectively suppress the formation of the CuSn intermetallic by replacing it with a Cu9Ga4 IMC layer in the as-soldered material, which grew with less deleterious morphology and finer thicknesses. (AU)

FAPESP's process: 17/12741-6 - Application of experimental solidification techniques, characterization of microstructure and properties in the evaluation of eutectic and hypereutectic Al-base and Zn-base alloys
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants