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(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Dendritic and eutectic growth of Sn-0.5 wt.%Cu solders with low alloying Al levels

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Author(s):
Lima, Thiago Soares [1] ; Silva, Bismarck Luiz [2] ; Garcia, Amauri [1] ; Cheung, Noe [1] ; Spinelli, Jose Eduardo [3]
Total Authors: 5
Affiliation:
[1] Univ Campinas UNICAMP, Dept Mfg & Mat Engn, Campinas, SP - Brazil
[2] Fed Univ Rio Grande Norte UFRN, Dept Mat Engn, Natal, RN - Brazil
[3] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
Total Affiliations: 3
Document type: Journal article
Source: PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART L-JOURNAL OF MATERIALS-DESIGN AND APPLICATIONS; v. 233, n. 9, p. 1733-1737, SEP 2019.
Web of Science Citations: 1
Abstract

The dependences of microstructures on the solidification thermal parameters of Sn-0.5 wt.%Cu, Sn-0.5 wt.%Cu-0.05 wt.%Al, and Sn-0.5 wt.%Cu-0.1 wt.%Al alloys are examined. Ranges of sizes and morphologies of microstructural phases have been quantitatively assessed due to the broad spectra of cooling rates and thermal gradients associated with the experiments. Various types of growth relations are proposed to represent the microstructural progresses. Al addition does not change either the matrix primary dendritic spacing or the spacing between Cu6Sn5 particles. However, it is shown that the secondary dendrite arm spacing, lambda(2), is greatly affected, increasing with the increase in the Al content. Both globular-type and fibrous-type morphologies typify the Cu6Sn5 intermetallics located in interdendritic zones. (AU)

FAPESP's process: 17/15158-0 - Characterization of microstructure and properties in the evaluation of alloys for thermal interface contact
Grantee:Amauri Garcia
Support Opportunities: Regular Research Grants
FAPESP's process: 16/10596-6 - Impulse Atomization of Sn-Zn and Al-Si alloys: correlations between microstructures/morphologies and processing parameters
Grantee:José Eduardo Spinelli
Support Opportunities: Scholarships abroad - Research
FAPESP's process: 15/11863-5 - Microstructure evaluation of ternary Al-Si-Cu, Sn-Bi-Sb and Zn-Sn-Cu and its correlations with mechanical properties
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants
FAPESP's process: 17/12741-6 - Application of experimental solidification techniques, characterization of microstructure and properties in the evaluation of eutectic and hypereutectic Al-base and Zn-base alloys
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants