Advanced search
Start date
Betweenand
Related content
(Reference retrieved automatically from Web of Science through information on FAPESP grant and its corresponding number as mentioned in the publication by the authors.)

Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses

Full text
Author(s):
Lima, Thiago Soares [1] ; de Gouveia, Guilherme Lisboa [2] ; Septimio, Rudimylla da Silva [1] ; da Cruz, Clarissa Barros [1] ; Silva, Bismarck Luiz [3] ; Brito, Crystopher [4] ; Spinelli, Jose Eduardo [2] ; Cheung, Noe [1]
Total Authors: 8
Affiliation:
[1] Univ Estadual Campinas, UNICAMP, Dept Mfg & Mat Engn, BR-13083860 Campinas, SP - Brazil
[2] Fed Univ Sao Carlos UFSCar, Dept Mat Engn, BR-13565905 Sao Carlos, SP - Brazil
[3] Fed Univ Rio Grande do Norte UFRN, Dept Mat Engn, BR-59078970 Natal, RN - Brazil
[4] Sao Paulo State Univ, UNESP, Campus Sao Joao da Boa Vista, Sao Joao da Boa Vista - Brazil
Total Affiliations: 4
Document type: Journal article
Source: METALS; v. 9, n. 2 FEB 2019.
Web of Science Citations: 1
Abstract

In this study, experiments were conducted to analyze the effect of 0.05 and 0.1 wt.% Al additions during the unsteady-state growth of the Sn-0.5wt.%Cu solder alloy. Various as-solidified specimens of each alloy were selected so that tensile tests could also be performed. Microstructural aspects such as the dimensions of primary, lambda(1), and secondary, lambda(2), dendritic arrays, and intermetallic compounds (IMCs) morphologies were comparatively assessed for the three tested compositions, that is, Sn-0.5wt.%Cu, Sn-0.5wt.%Cu-0.05wt.%Al, and Sn-0.5wt.%Cu-0.1wt.%Al alloys. Al addition affected neither the primary dendritic spacing nor the types of morphologies identified for the Cu6Sn5 IMC, which was found to be either globular or fibrous regardless of the alloy considered. Secondary dendrite arm spacing was found to be enlarged and the eutectic fraction was reduced with an increase in the Al-content. Tensile properties remained unaffected with the addition of Al, except for the improvement in ductility of up to 40% when compared to the Sn-0.5wt.%Cu alloy without Al trace. A smaller lambda(2) in size was demonstrated to be the prime microstructure parameter associated with the beneficial effect on the strength of the Sn-0.5wt.%Cu(-x)Al alloys. (AU)

FAPESP's process: 17/12741-6 - Application of experimental solidification techniques, characterization of microstructure and properties in the evaluation of eutectic and hypereutectic Al-base and Zn-base alloys
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants
FAPESP's process: 15/11863-5 - Microstructure evaluation of ternary Al-Si-Cu, Sn-Bi-Sb and Zn-Sn-Cu and its correlations with mechanical properties
Grantee:José Eduardo Spinelli
Support Opportunities: Regular Research Grants
FAPESP's process: 16/18186-1 - Microstructural evolution and mechanical and wear resistances of ternary Al-Bi-Si and Al-Bi-Ni alloys unidirectionally solidified
Grantee:José Marcelino da Silva Dias Filho
Support Opportunities: Scholarships in Brazil - Post-Doctoral